CIDAV is a leading technology manufacture of Printed Circuit Boards with
very short delivery time and competitive price.
Special New Processes:
Direct Metalization - Special new process DMS-E that create very high
quality connection between the hole wall copper plating to the inner layers of
the board. This process eliminate the use of electroless copper that reduce
the connection strength and the board life. This new process work in horizontal
production line to achieve high speed, High aspect ratio and high quality boards.
Direct Imaging - The new DP-100 Lazer Direct Imaging system from
Orbotech transfer the image directly from the CAM to the surface of the inner layers
and outer layers of the board without need of films. It create very high quality
fine line creation up to 50 micron lines/space. It also gives very high accuracy,
very good registration between all layers and very quick manufacturing.
Direct Legend Printer - New Legend Printer machine produce by
New-System from Italy. With this machine we print the legend directly on the boards
solder-mask with a very accurate fine line inkjet printing. This is instead the low
accuracy screen-printing technology. This machine enable to print very small characters
with very accurate positioning controlled by video camera.
Immersion Silver coating - New full automatic horizontal plating line
create a very high quality uniform silver layer on the exposed copper. It enable very
good solderability and compliance with ROHS requirements.
Immersion GOLD coating - New full automatic plating line
create a very high quality uniform Nickel/Gold layer on the exposed copper. It enable
very good solderability and compliance with ROHS requirements.
Immersion TIN coating - Other way to comply with ROHS. It enable very
good solderability but limited is holding time before assembly.
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